5–8 Oct 2026
Institute for Quantum Physics
Europe/Berlin timezone

Integration of Flip-Chip Photodiodes on Lithium Tantalate on Insulator (LTOI) Photonic Chips

7 Oct 2026, 10:15
15m
Institute for Quantum Physics

Institute for Quantum Physics

Luruper Chaussee 149

Speaker

Luise Heiland

Description

Quantum computers based on neutral atoms hold great potential for revolutionary discoveries across research and industry. However, scaling these systems requires precise, real-time control of laser power to manipulate atomic qubits reliably. Integrated photonics – especially based on electro-optically active materials such as LTOI – has emerged as a platform to pulse laser light used to control atoms. Yet LTOI lacks integrated photodetectors, so on-chip optical signals cannot be monitored directly on the same chip.

In my master's thesis project, I address this by hybrid-integrating low-noise photodiodes, fabricated on a separate platform, directly onto LTOI photonic chips via flip-chip bonding to realize closed-loop feedback for setting the working point of light modulators.

Working principle: A small fraction of the on-chip optical power is tapped off and guided to the flip-chip bonded photodiode via a 3D-nanoprinted out-of-plane coupler. The resulting photocurrent is processed by a PID control system that continuously adjusts the modulator's working point, laying the foundation for compact, self-regulating photonic modules.

In this work, I present the complete process from optical design and simulation, through chip fabrication, to the micro-assembly challenges of combining these two heterogeneous photonic platforms into a single functional device.

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